Semiconductor Packaging News2h
Intel rebuffs Arm after SoftBank-owned firm asked to buy US chip maker’s product unit
Intel rebuffs Arm after SoftBank-owned firm asked to buy US chip maker’s product unit: Summary Arm Holdings approached Intel about buying its chip product division but was told ...
Semiconductor Packaging News2h
Recogni Pivots To Data Center AI Inference Chips
Recogni, an AI chip startup, has shifted focus from automotive AI accelerators to generative AI inference in data centers. Leveraging its logarithmic number system (LNS) expertise, Recogni aims to ...
Semiconductor Packaging News2h
Taiwan has AI advantage, Pegatron chairman says
At a forum in Taipei, Pegatron Chairman Tung Tzu-hsien emphasized Taiwan’s strength in hardware manufacturing amid AI's rise. He noted that AI will strengthen already dominant enterprises and nations, ...
Semiconductor Packaging News2h
Korean chipmakers' reliance on Chinese raw materials deepens
Summary Korean chipmakers increased their reliance on Chinese raw materials in 2023 despite global supply chain uncertainties and U.S.-China tensions. Industry officials stress the need for sourcing ...
Semiconductor Packaging News4d
Axus Technology Delivers Lowest Cost of Ownership for CMP Processes on 200mm SiC Wafers
Axus Technology announced its flagship Capstone CS200 platform tools offer the industry’s lowest cost of ownership (CoO) for CMP processes on 200mm silicon carbide ... Semiconductor Packaging News is ...
Semiconductor Packaging News1y
Siemens extends collaboration with TSMC to advance integrated circuit & systems design
Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications ... Siemens Digital ...
Semiconductor Packaging News1y
SONOTEC with Compact Flow Meter Series for Semiconductor Applications at ICPT
We are optimistic about the upcoming months, although the uncertainty on the markets continues to influence our daily decisions. In recent years, we have learned to act prudently and flexibly. We have ...
Semiconductor Packaging News2mon
STMicroelectronics unveils new generation of silicon carbide power technology tailored for next-generation EV traction inverters
STMicroelectronics is introducing its fourth generation STPOWER silicon carbide (SiC) MOSFET technology. The Generation 4 technology brings new benchmarks in power ... The HFA80A automotive-grade ...
Semiconductor Packaging News4d
SkyWater Names Bassel Haddad as SVP & General Manager of Advanced Packaging
SkyWater Technology announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging. Reporting to President and COO ... Semiconductor Packaging News is ...
Semiconductor Packaging News4d
New CEA-Leti Technology Improves DC-DC Converter Efficiency
Building on its earlier breakthroughs introducing a new way of converting electrical power using piezoelectric resonators and developing a dual-bridge piezoelectric resonator ...
Semiconductor Packaging News6d
Flexible, space-saving class-D amplifier for in-car audio adds automotive-optimized diagnostics
The HFA80A automotive-grade analog-input class-D audio amplifier combines high efficiency, small size, and a low bill of materials, with load diagnostics optimized ... The STPMIC25 power-management IC ...
Semiconductor Packaging News4d
Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design
Siemens Digital Industries Software announced that Japan-based Preferred Networks Inc. (PFN) has selected Siemens' PowerPro™ software to optimize the power efficiency ... Siemens Digital Industries ...