Ensuring data gets to where it’s supposed to go at exactly the right time is a growing challenge for design engineers and architects developing heterogeneous systems. There is more data moving around ...
Perfection sometimes stands in the way of progress, and there is evidence this may be happening with chiplets. It may be time ...
A new technical paper titled “Towards Fine-grained Partitioning of Low-level SRAM Caches for Emerging 3D-IC Designs” was ...
A Compact Behavioral Model for Volatile Memristors” was published by researchers at Technion – Israel Institute of Technology ...
A new technical paper titled “Hardware Acceleration of Kolmogorov-Arnold Network (KAN) for Lightweight Edge Inference” was ...
A new technical paper titled “Bendable non-silicon RISC-V microprocessor” was published by researchers at Pragmatic Semiconductor, Qamcom, and Harvard University. From the abstract: “Here we present ...
A new technical paper titled “Using both faces of polar semiconductor wafers for functional devices” was published by ...
Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...
Creating complex multi-chiplet systems is no longer a back-of-the-envelope diagram, but viable methodologies are still in ...
The first, most well-proven, and obvious benefit of a chiplet-based approach is manufacturing cost. Manufacturing cost benefits are accrued either from the appropriate selection of chiplet die size, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback